DR. MICHAEL G. PECHT is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a Westinghouse Professor. He is the chief editor of the IEEE Transactions on Reliability, on the board of advisors for IEEE Spectrum, and a section editor for the Society of Automotive Engineering.

DR. ABHIJIT DASGUPTA is a tenured faculty member with the CALCE Electronic Packaging Research Center at the University of Maryland.

DR. JOHN W. EVANS is a program manager of the Electronic Packaging Program for NASA Headquarters in Washington, D.C.

JILLIAN Y. EVANS is an aerospace engineer at the NASA Goddard Space Flight Center Facility in Greenbelt, Maryland.